Using a novel simulation model based on machine learning, an international research team at GSI/FAIR has succeeded in gaining ...

Here we saw three examples of how engineers from the food and beverage industry use multiphysics modeling and simulation apps ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...