--Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18 A process technology. Intel Foundry and Ansys have also enabled a comprehensive ...

Ansys and TSMC extend partnership to deliver high-speed and high-capacity power integrity signoff design solutions spanning 16nm to 5nm processes PITTSBURGH, May 6, 2020 /PRNewswire/ -- Ansys (NASDAQ: ...

Enables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes. Delivers up to 10x faster design closure ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

PITTSBURGH -- June 24, 2022 -- Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys' power integrity software for TSMC's industry-leading N4P and N3E process ...

Ansys has announced that it has achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This will enable mutual customers to ...

Synopsys has introduced the first set of its Multiphysics Fusion solutions, aiming to help semiconductor designers manage the ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...

Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...