Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics Technology (JCET) says it will invest 7.8 billion ...

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TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a ...

Samsung Electronics is exploring a significant investment in Gwangju, South Korea. The company is considering a new advanced semiconductor packaging facility. This move aims to boost its capabilities ...

Intel, GlobalFoundries and Infineon are some of the chip makers that have set up or expanded operations in Malaysia over the last few years. "Malaysia has well-established infrastructure with around ...