Rambus Inc. has announced the introduction of its memory controller interface solution for industry-standard DDR3 DRAM. The fully integrated hard macro cell provides the physical layer (PHY) interface ...

Samsung Electronics Co., Ltd. today announced the development of 1 gigabit (Gb) mobile DRAM with a wide I/O interface, using 50 nanometer class* process technology. The new wide I/O mobile DRAM will ...

The acquisition adds software designed to make flash behave more like DRAM and lower data center memory costs.

Intel is collaborating with Saimemory to develop Z-Angle Memory (ZAM), a new DRAM technology that stacks RAM vertically to increase memory density. PCWorld reports that prototypes are expected by 2027 ...

SE: As we struggle with AI/ML and power demands, what configurations need to be rethought? Will we see a shift away from Von Neumann architecture? Woo: In terms of system architectures, there’s a ...

Rambus makes revenue in three ways: memory interface chips, which protect and control the flow of data between the memory chip and CPU or GPU in a server; royalty revenue, in which Rambus licenses its ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Smartphones are running into a memory problem, and it’s not something a software update can fix. As you may be aware, phone ...

Concept on world production shortage of microchips and semiconductors. Imagine you’re driving down a highway at night, across a desolate stretch—let's say Highway 22E in Alaska, 200 miles from the ...