Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

SK hynix just announced the delivery of its 12-layer HBM4E memory samples to major hardware clients, intensifying the competition to supply the memory backbone for future AI accelerators. The new fat ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

HBF offers ten times HBM capacity while remaining slower than DRAM GPUs will access larger data sets through tiered HBM-HBF memory Writes on HBF are limited, requiring software to focus on reads The ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...