Micron is on a tear, it seems. The company recently announced the world's first "Gen 2" version of its third-generation high-bandwidth memory (HBM3) that offers increased bandwidth and density over ...

Samsung Electronics says its new 12nm-Class 32Gb DDR5 DRAM will allow for the creation of 128GB DRAM modules without the TSV process and could lead to 1TB DRAM modules in the future. With companies ...

Micron just put out a press release crowing about its latest achievement: 8-high HBM3 Gen2 memory stacks with up to 24GB of capacity and a 50% improvement in per-pin transfer rate over extant HBM3.

Micron’s Crucial division today launched what the company says will be the next stage in the evolution of the PC’s humble memory module: CUDIMMs for laptops and CSODIMMs for desktops. Both will be ...